At Architecture Day 2020, Intel Chief Architect Raja Koduri, Intel fellows and architects provided details on the progress Intel is making on its six pillars of technology innovation: process and packaging, architecture, memory, interconnects, security and software. Intel is taking full advantage of its unique position to deliver a mix of scalar, vector, matrix and spatial architectures deployed in CPUs, GPUs, accelerators and FPGAs – unified by oneAPI, an industry-standard open programming model to simplify application development.
Intel revealed its 10nm SuperFin technology, representing the largest single intranode enhancement in the company’s history and delivering performance improvement comparable to a full-node transition. Intel also unveiled architectural details of its Willow Cove microarchitecture and the Tiger Lake system-on-chip architecture for mobile client and provided first looks at its fully scalable Xe graphics architectures. Together with Intel’s disaggregated design approach and coupled with advanced packaging technology, XPU offerings and software-centric strategy, the company is focused on developing leading products across its portfolio to customers.
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» 6 Technology Pillars Overview, Process and Packaging Update
» Tiger Lake, Willow Cove, CPU Roadmap
» GPU Roadmap, Xe LP Architecture and Software
» FPGAs, Memory, Interconnect
» Security, AI Software, oneAPI
» Data center, Client, Intel Labs