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Foveros
July 5, 2021
The Revolutions that Led to Chips Made Like Quilts
June 10, 2020
Hybride Intel® Prozessoren liefern kompromisslose PC-Erfahrung für neue Formfaktoren wie duale und faltbare Bildschirme
April 28, 2020
Intels sechs Säulen der Innovation
February 11, 2020
Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech
October 4, 2019
Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core
July 10, 2019
Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox
May 9, 2019
2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021
January 7, 2019
2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration
December 12, 2018
New Intel Architectures and Technologies Target Expanded Market Opportunities
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